Multichip modules: systems advantages, major constructions, and materials technologies / edited by R. Wayne Johnson, Robert K. F. Teng, John W. Balde
Сохранено в:
| Вид документа: | |
|---|---|
| Опубликовано: | New York : IEEE Press , 1991 |
| Физические характеристики: |
IX, 603 c. : іл., партр.
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| Язык: | Английский |
| Серия: |
IEEE Press selected reprint series
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